Testing Standard - IEC 60749-25

Application:
IEC

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Standard: 
IEC 60749-25
Description: 
This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Testing For: 
Semiconductor devices

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