Testing Standard - IEC 60749-25

Standard: 

IEC 60749-25

Description: 

This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

Testing For: 

Semiconductor devices