Cold and Hot Dwells - Scenario 1

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Testing For: 
  • Semiconductor devices
  • Crystalline silicon terrestrial photovoltaic (PV) modules
  • Solar Panel Testing
  • It applies when the product specification calls for a reliability growth program of equipment(electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
  • Solder joints, glued interfaces and other parts that are stressed by differences in CTE
  • Semiconductor devices
  • Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions, within a controlled environment
  • This Handbook is intended for use by both contractor and government personnel during the conceptual, validation, full scale development, production phases of an equipment/system life cycle.
  • IEC 61215
  • IEC 61014
  • IPC-9592A
  • JESD-A105C
  • MIL-HDBK338B
  • MIL-HDBK-344A
  • MIL-HDBK-2164A
  • MIL-STD-810G
  • MIL-STD-883J
  • MlL-STD- 1540C
  • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
  • EMBRAER Quality Requirements for Suppliers
  • Shenzhen Metrology and Quality (SMQ) Institute
Failure Type : 
F(d) = Failures accelerated by hot and cold dwells (particularly solder creep)
Cold and Hot Dwells
Typical Failures Detected: 
  • Same as hot step.
  • As in Hot Step components contracting during cold, faulty solder maximizes chances of cracks at weak links.
  • Bearings, bushings tighten, showing areas most likely to be restricted.
  • Manufacturing errors that push tolerance stack up to one side or the other.
  • Components that don’t meet spec value or dynamic range.
  • Solder creep
Qualmark Accelerated Reliability System: 
+200°C, -100°C at >70°C/min
Testing Scenario Type: 
Cold and Hot Dwells

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