Cold and Hot Dwells - Scenario 3

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Testing For: 
  • This standard is intended to apply only to microelectronic devices.
  • The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
  • Environmental Stress Screening for Electronic Equipment using Highly Accelerated Tests GUIDE January 2006 Edition © DEV HA ESS R25 2006
  • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
  • General Motors Engineering and Manufacturing operations and all GM suppliers
  • All Electronic Parts and Assemblies
  • Electrical Components used in road vehicle applications
  • Electric and Hybrid Vehicle - Rechargeable Energy Storage
  • IEC 62133
  • IEC 62660-2
Failure Type : 
F(d) = Failures accelerated by hot and cold dwells (particularly solder creep)
Cold and Hot Dwells
Qualmark Accelerated Reliability System: 
+200°C, -100°C at >70°C/min
Testing Scenario Type: 
Cold and Hot Dwells

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