Thermal Cycling in Combination with RS Vibration - Scenario 1

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Testing For: 
  • Components, equipment or other articles to withstand rapid changes of ambient temperature
  • Connectors for electronic equipment
  • Semiconductor devices
  • Fiber optics
  • Crystalline silicon terrestrial photovoltaic (PV) modules
  • Solar Panel Testing
  • It applies when the product specification calls for a reliability growth program of equipment (electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
  • Solder joints, glued interfaces and other parts that are stressed by differences in CTE
  • Components and solder interconnects
  • Semiconductor devices
  • Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions within a controlled environment
Standard: 
  • IEC 61014
  • IEC 61300-22-2
  • IEC 61215
  • IPC-9592A
  • DESIGN FOR RELIABILITY HANDBOOK TECHNICAL REPORT NO. TR-2011-24
  • MIL-HDBK338B
  • MIL-HDBK-344A
  • MIL-HDBK-2164A
  • MIL-STD-810G
  • MIL-STD-883J
  • MlL-STD- 1540C
  • JESD-A105C
  • EIA-364-32
  • EIA/ECA-364-110
  • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
  • EMBRAER Quality Requirements for Suppliers
  • GM WORLDWIDE ENGINEERING STANDARDS GMW8287
Failure Type : 
F(c) = failures only accelerated by a combined thermal and vibration stress environment
Stressor: 
Thermal cycling in combination with RS vibration
Typical Failures Detected: 
  • Rapid Thermal in Combination with vibration, puts maximum stress on surface mount components.
  • Components will expand/contract at different rates than the unit beneath. Addition of high frequency vibration makes stressful environment for marginal surface mount solder joints. Changes in temperature during vibration cause components and materials to respond differently at different temperatures. Similar to what a product endures once put into the end use environment.
Qualmark Accelerated Reliability System: 
+200°C to -100°C at >70°C/min in combination with RS vibration up to 70gRMS
Testing Scenario Type: 
Thermal Cycling with RS Vibration

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