Thermal Cycling - Scenario 1

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Testing For: 
  • Components, equipment or other articles to withstand rapid changes of ambient temperature
  • Connectors for electronic equipment
  • Semiconductor devices
  • Fiber optics
  • It applies when the product specification calls for a reliability growth program of equipment (electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
  • Solder joints, glued interfaces and other parts that are stressed by differences in CTE
  • Components and solder interconnects
  • Semiconductor devices
  • Tin and tin alloy surfaces
  • Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions, within a controlled environment
  • IEC 60068-2-14
  • IEC 60749-25
  • IEC 61300-22-2
  • IEC 61014
  • IPC-9592A
  • JESD22-A104D
  • JESD-A105C
  • MIL-HDBK338B
  • MIL-HDBK-344A
  • MIL-HDBK-2164A
  • MIL-STD-810G
  • MIL-STD-883J
  • MlL-STD- 1540C
  • EIA-364-32
  • EIA/ECA-364-110
  • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
  • EMBRAER Quality Requirements for Suppliers
Failure Type : 
F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
Thermal Cycling
Typical Failures Detected: 
  • Different parts of unit can be at different temperatures, maximizing parametric drift issues.
  • Transient software issues detected due to tight timing.
  • Mechanical fatigue of rapid thermal causes faulty solder joints or components to crack.
  • Mechanical mismatch that causes excessive stress and failures.
  • Hardware values that shift unevenly out of compensation range of SW/FW.
Qualmark Accelerated Reliability System: 
Testing Scenario Type: 
Thermal Cycling

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