Thermal Cycling - Scenario 3

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Testing For: 
  • For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
  • Electrical Connectors and Sockets
  • The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
  • Environmental Stress Screening for Electronic Equipment using Highly Accelerated Tests GUIDE January 2006 Edition © DEV HA ESS R25 2006
  • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
  • General Motors Engineering and Manufacturing operations and all GM suppliers
  • All Electronic Parts and Assemblies
  • Electrical Components used in road vehicle applications
Standard: 
  • UL 1642
  • IEC 62133
  • IEC 62660-2
  • For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. Same for the following - The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
    • Environmental Stress Screening for Electronic Equipment using Highly Accelerated Tests
    • GUIDE January 2006 Edition ©
    • DEV HA ESS R25 2006
    • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
    • General Motors Engineering and Manufacturing operations and all GM suppliers
Failure Type : 
F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
Stressor: 
Thermal Cycling
Qualmark Accelerated Reliability System: 
>70°C/min
Testing Scenario Type: 
Thermal Cycling

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